Electrical Engineer (Systems / Integration / Experimentation)

What you’ll do

1. Be the generalist EE for the scanner system: integration, bring-up, debugging, and making the electrical side of the device reliable and serviceable.

2. Own ultrasound experimentations that feeds the image reconstruction team

   • Design and execute experiment setups for transducer characterization (element sensitivity, bandwidth, cross-talk mapping, beam profile measurements) and ex vivo / phantom clinical testing.

   • Acquire, process, and analyze RF and baseband signals for data quality assessment and benchmarking.

3. Design simple boards and adapters as needed (monitoring, power/safety, interface/conditioning), and take them from prototype through a stable revision.

4. Prototype quickly, then harden what works: wiring/harnessing, grounding, safety interlocks, and reliable integration across subsystems.

5. Own practical test setups and documentation (fixtures, scripts, procedures) that make experiments repeatable and results comparable over time.

What we’re looking for

• Strong hands-on EE background with experience building, debugging, and iterating on real systems in the lab.

• Solid understanding of signal processing fundamentals — knows what to measure, how to condition and digitize it, and how to evaluate signal quality in the context of an imaging system (SNR, bandwidth, dynamic range, artifacts).

• Comfortable spanning system integration + occasional design work (schematics/layout reviews or light PCB design) in a fast-moving environment.

• Ability to work at the boundary between hardware and algorithms: measure reality, communicate constraints, and help close gaps vs simulation.

• High agency and practicality: able to set up experiments, get trustworthy data, and unblock others on a lean team.

Useful experience

• Analog/mixed-signal, or high-speed data capture experience; strong instincts for instrumentation and noise/debugging.

• Ultrasound or acoustic sensor handling: hydrophone calibration and field mapping, transducer impedance characterization, element-level sensitivity and bandwidth testing, acoustic coupling optimization (water path, gel, membrane interfaces).

• Signal processing skills: spectral analysis (FFT, short-time spectra), time-frequency methods, matched filtering, envelope detection / Hilbert transforms, time-of-flight extraction, and coherent vs. incoherent averaging for SNR improvement.

• Understanding of imaging principles or direct experience with imaging systems: beamforming concepts (delay-and-sum, synthetic aperture), point spread function characterization, resolution/contrast metrics, image artifact identification (grating lobes, side lobes, ring artifacts, motion blur).

• Wave physics background (acoustic, EM, or optical): propagation, reflection/transmission at interfaces, attenuation and dispersion in tissue-mimicking media, near-field vs. far-field behavior, diffraction.

• Light PCB design for simple boards (Altium/KiCad/etc.) and comfort bringing boards up on the bench.

• Comfort aligning “device reality” with “model reality” (calibration, timing, parameter tracking, reproducibility).

• Safety-conscious integration experience (EMI/EMC, grounding, interlocks) in complex electromechanical systems.